Precision stencils for wafer bumping

Precision plates above 50μm thick are used for wafer bump stencils. These are processed tension free and to high accuracy in climate controlled conditions with highly accurate laser systems.

Stencil for wafer bumping - DREMICUT GMBH
Detail of a stencil for wafer bumping (75µm thickness)

These place particularly high demands on the laser equipment and the engineer’s technical know-how.

It is dependent here upon placing the least thermal demand on the material. The results are deformation free stencils with up to several hundred thousand pads.