Step Stencils

A metal stencil produced with individual and partial incremental thickness reduction can be used to apply different amounts of, for example, solder paste, particularly in special SMD applications.

Step stencil; material partially reduced in thickness from 150µm to 90µm

The application of the relevant amounts of solder for the components is implemented primarily through the correct selection of the required stencil thickness. This selection is influenced by the basic design rules applicable to the components. A final decision, however, is always in the hands of experienced manufacturing engineers.

Alternatively stepped stencils can be used. In this case the required solder paste volumes are regulated by partial adjustment of the stencil thickness. 

These expensive stepped stencils, however, are in many applications not mandatory.
Frequently, different volumes of the paste can be applied due to the professional design adjustments of the pad structure.