High tech stencils for BGA, LTCC, Solar

Special demands on the stencil production need to be considered for semiconductor and hybrid technologies.

By using these precision stencils different substances can be applied in print procedures.

Stencil for solder paste printing for a BGA component

In the case of printing using BGA/μBGA, LTCC, Solar, flip chip technologies and for particular high density stencils, metal foils are used with a material thickness from 20μm.

The production of these stencils, tension free, plane and with very high accuracy, places particularly high demands on our production technology and know-how.

As is true for the wafer bump stencils, the material must be minimally thermally affected in order to produce deformation free stencils with sometimes more than one hundred thousand openings.